Surface Mount PCB Assembly

A significant and continuous expenditure on equipment has been made to ensure the facility can function efficiently and this is reviewed continually to obtain performance figures for the section.

SMT Capabilities include :

. Placement of QFP, SOP, SOJ, PLCC, BGA etc. down to 0.1mm pitch using vision recognition

. Placement of chip components down to 01005

. Placement of IC's up to 56mm x 56mm x 15mm

. Automatic board handling up to 443mm x 508mm x 6mm

. Rework of all standard package types

. Specialist BGA Rework, Inspection and Test Equipment

The equipment available for assembly, rework and test on surface mount and BGA assembly is listed below: -

•  MYDATA MY15e Placement M/C

•  TESCON POINT 501 Placement M/C's

•  TESCON POINT 333-M Placement M/C's

•  DEK Horizon 03i Automatic Printer

•  DEK 248 Semi Automatic Printers

•  DEK 247 Screen Printer

•  Research Microflo 8 Reflow Ovens

•  ERSA Fine Pitch/BGA Manual Inspection, Rework & Placement Equipment

•  Zehntel 1800 ATE Tester

•  TESCON POINT 5588 Flying Probe Testers

•  ERSASCOPE - Vision Inspection System

•  NXR 1400 X-Ray System